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检索条件"作者=Tsai, Ming-Hsing"
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Relationship between wafer edge design and its ultimate mechanical strength
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Microelectronic Engineering 2010年 第11期87卷 2065-2070页
作者: Chen, Po-Ying PLin121@ms.ccafps.khc.edu.tw Tsai, Ming-Hsing Yeh, Wen-Kuan Jing, Ming-Haw Chang, Yukon Department of Information Engineering I-Shou University No. 1 Sec. 1 Syuecheng Road Dashu Township Kaohsiung County 840 Taiwan ROC Department of Electronic Engineering National University of Kaohsiung No. 700 Kaohsiung University Road Nan-Tzu District Kaohsiung 811 Taiwan ROC
Due to its brittle nature, high stress-induced in manufacturing process, silicon wafer breakage has become a major concern for all semiconductor fabrication line. Furthermore, the production cost had increased in adva... 详细信息
来源: ElsevierScienceDirect期刊 ElsevierScienceDirec... EBSCOASC期刊 EBSCOASC期刊 评论
Relationship between wafer fracture reduction and controlling during the edge manufacturing process
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Microelectronic Engineering 2010年 第10期87卷 1809-1815页
作者: Chen, Po-Ying poychen@isuedu.tw Tsai, Ming-Hsing Yeh, Wen-Kuan Jing, Ming-Haw Chang, Yukon Department of Information Engineering I-Shou University No. 1 Sec. 1 Syuecheng Road Dashu Township Kaohsiung County 840 Taiwan Department of Electronic Engineering National University of Kaohsiung No. 700 Kaohsiung University Road Nan-Tzu District Kaohsiung 811 Taiwan
Given the trend towards wafers of a larger diameter, microelectronics circuits are driven by modern IC manufacturing technology. Silicon wafer breakage has become a major concern of all semiconductor fabrication lines... 详细信息
来源: ElsevierScienceDirect期刊 ElsevierScienceDirec... EBSCOASC期刊 EBSCOASC期刊 评论
The Impact of Strain Technology on FUSI Gate SOI CMOSFET
IEEE Transactions on Device and Materials Reliability
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IEEE Transactions on Device and Materials Reliability 2009年 第1期9卷 74-79页
作者: Yeh, Wen-Kuan Wang, Jean-An Tsai, Ming-Hsing Lin, Chien-Ting Chen, Po-Ying Department of Electrical Engineering National University of Kaohsiung Kaohsiung 811 Taiwan National University of Kaohsiung Kaohsiung 811 Taiwan Central R and D Division United Microelectronics Corporation Kaohsiung 811 Taiwan Department of Information Engineering I-Shou University Kaohsiung 840 Taiwan
In this paper, the impact of strain engineering on device performance and reliability for fully silicide gate silicon-on-insulator CMOSFET was investigated. With characterizing device's electrical property after hot c... 详细信息
来源: IEEE期刊 IEEE期刊 评论